教师名录

余春

副研究员
所属二级机构:智能化焊接与材料精密制造研究所
硕导/博导:博导
通讯地址:买球官网入口买球官网入口F楼301室
电子邮箱:yuchun1980@sjtu.edu.cn
办公电话:18101853937
教育经历
  • 1998-09 ~ 2002-07    江苏科技大学   材料科学与工程     学士
  • 2002-09 ~ 2005-02    江苏科技大学   材料科学与工程     硕士
  • 2005-02 ~ 2009-03    买球官网入口   材料科学与工程     博士
工作经历
  • 2009-04 ~ 2018-12    买球官网入口  助理研究员
  • 2019-01 ~ 至今    买球官网入口  副研究员
研究方向
  • 焊接界面及可靠性
  • 焊接过程数值模拟
研究情况

通过设计加速试验和多尺度/多物理场模拟计算方法相结合,开展了微互连界面可靠性相关热点问题(电迁移、Kirkendall空洞)、异种材料焊接方法及界面微缺陷问题等研究。

荣誉信息
  • 上海市优秀博士论文
  • 买球官网入口“SMC-晨星青年学者奖励计划”(B)类
  • 买球官网入口优秀共产党员
  • 买球官网入口优秀班主任
论文信息
  • Qingzhao Wang, Maolong Zhang, Weihua Liu, Xiao Wei, Jijin Xu, Junmei Chen, Hao Lu*, Chun Yu*. Cr or C controlled formation of transition martensite in dissimilar metal weld. Materials Characterization 147 (2019) 434–442.
  • Jijin Xu, Jingyao Chen, Chun Yu*, Yi Duan, Junmei Chen, Hao Lu*. Comparison of residual stress induced by TIG and LBW in girth weld of AISI 304 stainless steel pipes. Journal of Materials Processing Tech. 248(2017) 178-184.
  • Qingzhao Wang, Maolong Zhang, Weihua Liu, Xiao Wei, Jijin Xu, Junmei Chen, Hao Lu*, Chun Yu*. Study of type-II boundary behavior during SA508-3EQ309L overlay weld interfacial failure process. Journal of Materials Processing Tech. 247(2017) 64-72.
  • Dezhi Yang, Chen Hua, Shengzhi Qu, Jijin Xu, Junmei Chen, Chun Yu*, Hao Lu*. Isothermal transformation of γ-Co to ε-Co in Stellite 6 coatings. Metallurgical and Materials Transactions A 50A (2019) 1153-1161.
  • Chen Hua, Hao Lu*, Chun Yu*, Junmei Chen, Maolong Zhang, Dayong Li. Reduction of Laves phase in nickel alloy welding process under ultrasonic ampere force. Journal of Materials Processing Tech 252(2018)389-397.
  • Chen Hua, Hao Lu, Chun Yu*, Jun-Mei Chen, Xiao Wei, Ji-jin Xu. Reduction of ductility-dip cracking susceptibility by ultrasonic-assisted GTAW. Journal of Materials Processing Technology 239 (2017) 240-250.
  • Jie-Shi Chen, Cheng-Hui Ye, Chun Yu*, Hao Lu*. The micro-mechanism for the effect of Sn grain orientation on substrate consumption in Sn solder joints. Computational Materials Science 108(2015) 1-7.
  • Chun Yu, Yang Yang, Jieshi Chen, Jijin Xu, Junmei Chen, Hao Lu*. Effect of deposit thickness during electroplating on Kirkendall voiding at Sn/Cu joints. Materials Letters 128(2014) 9-11.
  • Chun Yu,Jieshi Chen,Zhewen Cheng,Yuqian Huang,Junmei Chen,Jijin Xu*,Hao Lu*,Fine grained Cu film promoting kirkendall voiding at Cu3Sn/Cu interface,Journal of Alloys and Compounds 660 (2016) 80-84.
  • Xiao Wei, Mengjia Xu, Qingzhao Wang, Maolong Zhang, Weihua Liu, Jijin Xu, Junmei Chen, Hao Lu*, Chun Yu*. Effect of local texture and precipitation on the ductility dip cracking of ERNiCrFe-7A Ni-based overlay. Materials and Design 110 (2016) 90-98.
  • Chun Yu, Dongye Wang, Jieshi Chen, Jijin Xu, Junmei Chen, Hao Lu*. Study of Cu6Sn5 and Cu3Sn growth behaviors by considering Trace Zn. Materials Letters 121(2014) 166-169.
  • Jie Shi Chen, Cheng Hui Ye, Jun Mei Chen, Ji Jin Xu, Chun Yu*, Hao Lu*. Sn whiskers mitigation by refining grains of Cu substrate during the room temperature exposure. Materials Letters 161 (2015) 201-204.
  • Chun Yu, Jieshi Chen, Kai-yun Wang, Jingqing Chen, Hao Lu*. Suppression effect of Cu and Ag on Cu3Sn layer in solder joints. Journal of Materials Science: Materials in Electronics 24(2013) 4630-4635